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Parts and materials technology development
MOTIE signs MOU to encourage next generation smart semiconductor development 2020-09-11
(20.09.10)차세대지능형반도체 사업단 출범식05.JPG 1
Trade, Industry and Energy Minister Sung Yun-mo (center) attended a signing ceremony for the memorandum of understanding (MOU) aimed to boost the development of the next generation smart semiconductors at Korea Semiconductor Industry Association in Pangyo, Gyeonggi Province, on September 10.

The ceremony was attended by Science and ICT minister Choi Ki-young as well, and the two ministries promised to put efforts together for the technological competitiveness of semiconductor materials, parts, and equipment.